ISSN: 0970-938X (Print) | 0976-1683 (Electronic)

Biomedical Research

An International Journal of Medical Sciences

Abstract

Analysis of correlation between the scores of residual bone cement and low back pain after percutaneous vertebroplasty in osteoporotic compression fractures

Objective: To study the correlation between the scores of pedicle residual bone cement and the low back pain after percutaneous vertebroplasty for osteoporotic vertebral body compression fractures.

Methods: Eighty-four patients receiving percutaneous vertebroplasty from January 2013 to May 2015 were followed up for 1 y and had varying degrees of low back pain. They were selected as subjects. According to the patient's prognosis results, the patients were divided into group A (favourable prognosis) and group B (poor prognosis). Each group had 42 cases. The scores of pedicle residual bone cement between two groups were compared and the relationship of pedicle residual bone cement scores with VAS scores was analysed.

Results: There was a significant difference of VAS score between two groups. After treatment, VAS scores in group A (2.24 ± 0.78) were significantly lower than those in group B (4.52 ± 0.95, P<0.05). The scores of inside and outside pedicle residual bone cement in group A (0.21 ± 0.05 and 0.25 ± 0.07) were significantly lower than those in group B (0.38 ± 0.12 and 0.45 ± 0.16, P<0.05). There was a positive correlation between scores of inside and outside pedicle residual bone cement and low back pain following surgery (r=0.749, 0.761, P=0.000, 0.000). The incidence of refracture (0%) and the length of stay (7.62 ± 2.45) d in group A were significantly lower than those in group B (P<0.05).

Conclusion: There was a positive correlation between pedicle residual bone cement scores and the low back pain after percutaneous vertebroplasty for osteoporotic vertebral body compression fractures, which suggests that residue bone cement should be removed and so to improve the treatment effect and reduce the degree of low back pain.

Author(s): Jianquan Liu, Zhe Zhao, Wencui Li
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